Invention Grant
- Patent Title: Semiconductor device and a method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13181583Application Date: 2011-07-13
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Publication No.: US08367503B2Publication Date: 2013-02-05
- Inventor: Junli Wang , Tomoyuki Hirano , Toyotaka Kataoka , Yoshiya Hagimoto
- Applicant: Junli Wang , Tomoyuki Hirano , Toyotaka Kataoka , Yoshiya Hagimoto
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2007-179387 20070709
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor device, including: a first group of transistors formed on a semiconductor substrate; and a second group of transistors formed on the semiconductor substrate, each of which is lower in operating voltage than each of the transistors in the first group; wherein each of the transistors in the first group includes a first gate electrode formed on the semiconductor substrate through a first gate insulating film, and a silicide layer formed on the first gate electrode; each of the transistors in the second group includes a second gate electrode formed in a trench for gate formation, formed in an insulating film above the semiconductor substrate, through a second gate insulating film; and a protective film is formed so as to cover the silicide layer on each of the first gate electrodes of the first group of transistors.
Public/Granted literature
- US20110269280A1 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-11-03
Information query
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