Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing the same
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US13144182Application Date: 2011-03-04
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Publication No.: US08367490B2Publication Date: 2013-02-05
- Inventor: Huilong Zhu , Qingqing Liang , Haizhou Yin , Zhijiong Luo
- Applicant: Huilong Zhu , Qingqing Liang , Haizhou Yin , Zhijiong Luo
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Kinney & Lange, P.A.
- International Application: PCT/CN2011/071530 WO 20110304
- International Announcement: WO2012/055201 WO 20120503
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/84

Abstract:
The present application discloses a semiconductor structure and a method for manufacturing the same. The semiconductor structure according to the present invention adjusts a threshold voltage with a common contact, which has a portion outside the source or drain region extending to the back-gate region and provides an electrical contact of the source or drain region and the back-gate region, which leads to a simple manufacturing process, an increased integration level and a lowered manufacture cost. Moreover, the asymmetric design of the back-gate structure further increases the threshold voltage and improves the performance of the device.
Public/Granted literature
- US20120104495A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-05-03
Information query
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