Invention Grant
- Patent Title: Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
- Patent Title (中): 光电半导体元件和光电半导体元件的制造方法
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Application No.: US13122578Application Date: 2009-09-08
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Publication No.: US08367438B2Publication Date: 2013-02-05
- Inventor: Andreas Plöβl
- Applicant: Andreas Plöβl
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102008050573 20081006
- International Application: PCT/DE2009/001269 WO 20090908
- International Announcement: WO2010/040331 WO 20100415
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An optoelectronic semiconductor component includes a semiconductor body connected to a main area of a carrier body by a solder layer, wherein sidewalls of the semiconductor body are provided with a dielectric layer, and a mirror layer applied to the dielectric layer.
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