Invention Grant
US08367283B2 Positive photosensitive resin composition, cured film, protecting film, insulating film and semiconductor and display devices using the same
失效
正性感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体以及使用其的显示装置
- Patent Title: Positive photosensitive resin composition, cured film, protecting film, insulating film and semiconductor and display devices using the same
- Patent Title (中): 正性感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体以及使用其的显示装置
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Application No.: US13054889Application Date: 2009-07-16
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Publication No.: US08367283B2Publication Date: 2013-02-05
- Inventor: Miki Terayama
- Applicant: Miki Terayama
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-188277 20080722
- International Application: PCT/JP2009/062894 WO 20090716
- International Announcement: WO2010/010842 WO 20100128
- Main IPC: G03F7/023
- IPC: G03F7/023
Abstract:
The positive photosensitive resin composition of the present invention has a polyamide resin and a photosensitive agent, wherein the polyamide resin has a specific structure. The cured film of the present invention has a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention has the cured film each. The semiconductor device and display device of the present invention has the cured film each.
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