Invention Grant
- Patent Title: Processing apparatus and processing method
- Patent Title (中): 处理装置及处理方法
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Application No.: US12226089Application Date: 2007-04-06
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Publication No.: US08366869B2Publication Date: 2013-02-05
- Inventor: Toshihisa Nozawa , Koji Kotani , Kouji Tanaka
- Applicant: Toshihisa Nozawa , Koji Kotani , Kouji Tanaka
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2006-106107 20060407
- International Application: PCT/JP2007/057768 WO 20070406
- International Announcement: WO2007/116969 WO 20071018
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306 ; C23C16/455 ; C23C16/52 ; C23C16/06 ; C23C16/22

Abstract:
A processing apparatus includes a process container having a placing table for placing a processing object, an exhaust system having vacuum pumps and a pressure control valve for exhausting atmosphere in the process container. A gas injection unit having a gas ejection hole is provided in the process container, as well as a gas supplying unit for supplying a process gas to the gas injection unit. The entire process apparatus is controlled by a controlling unit. The control unit controls the exhaust system and the gas supplying unit. When starting a predetermined process, the process gas at a flow rate greater than a prescribed flow rate is supplied for a short time while exhausting the atmosphere in the process container by the exhaust system, and then the process gas at a prescribed flow rate is supplied.
Public/Granted literature
- US20090053900A1 Processing Apparatus and Processing Method Public/Granted day:2009-02-26
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