Invention Grant
- Patent Title: Shower head and substrate processing apparatus
- Patent Title (中): 淋浴头和基材加工设备
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Application No.: US12406339Application Date: 2009-03-18
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Publication No.: US08366828B2Publication Date: 2013-02-05
- Inventor: Hachishiro Iizuka
- Applicant: Hachishiro Iizuka
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2008-071475 20080319; JP2009-003913 20090109
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/52 ; C23F16/00 ; H01L21/306 ; C23C16/06 ; C23C16/22
Abstract:
A shower head is provided in a processing chamber for processing a substrate therein to face a mounting table for mounting thereon the substrate and formed of a laminated body in which a plurality of plate-shaped members are laminated. The shower head serves to supply one or more gases in a shower shape toward the substrate. The shower head includes a first gas supply unit for supplying a first gas toward the substrate through first gas injection openings provided in the laminated body, a second gas supply unit for supplying a second gas through second gas injection openings provided in the laminated body and a plurality of gas exhaust holes, formed through the laminated body, for exhausting a gas through a portion of the laminated body, the portion facing the mounting table.
Public/Granted literature
- US20090236041A1 SHOWER HEAD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2009-09-24
Information query
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