A vacuum processing apparatus includes a transfer container for transferring a wafer in the internal space thereof reduced in pressure, a vacuum vessel coupled to the side wall of the vacuum vessel and including a processing chamber having a sample stage therein on which a wafer to be processed is mounted, a lid member opened or closed by rotation above the vacuum vessel, an inner chamber member arranged in the vacuum vessel and making up the inner wall of the processing chamber, and a jig coupled to the side wall of the vacuum vessel to lift and hold the inner chamber member by being coupled thereto. The jig includes a first joint portion having vertical and horizontal shafts, an extensible arm portion rotatable around each shaft of the first joint portion, and a second joint portion with the inner chamber member adapted to rotate around the horizontal axis thereof.