Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.