This invention enables information on a connection wiring with a substrate of a mounted component to be accurately and easily inputted in an X-ray examination apparatus. In teaching of a substrate examination, when a user inputs a two-dimensional region of a component to be examined with respect to a visible light image of the substrate, three-dimensional data is generated for the relevant region, which data is then analyzed to acquire a center coordinate, the number, the number of rows, and the number of columns on a ball terminal connecting the component to the substrate. Results such as the center coordinate acquired in such a manner may be displayed. The visible light image for the substrate is displayed in a display field of a screen. In the display field, a frame corresponding to a region acquired as an examination target is displayed in accordance with the visible light image, and a frame corresponding to each solder ball is displayed based on a position and the like of the solder ball acquired based on the three-dimensional data.