Invention Grant
US08286046B2 Integrated circuit testing module including signal shaping interface 有权
集成电路测试模块包括信号整形接口

  • Patent Title: Integrated circuit testing module including signal shaping interface
  • Patent Title (中): 集成电路测试模块包括信号整形接口
  • Application No.: US13162112
    Application Date: 2011-06-16
  • Publication No.: US08286046B2
    Publication Date: 2012-10-09
  • Inventor: Adrian E. Ong
  • Applicant: Adrian E. Ong
  • Applicant Address: US CA Sunnyvale
  • Assignee: Rambus Inc.
  • Current Assignee: Rambus Inc.
  • Current Assignee Address: US CA Sunnyvale
  • Agency: Lowenstein Sandler PC
  • Main IPC: G06F11/00
  • IPC: G06F11/00
Integrated circuit testing module including signal shaping interface
Abstract:
Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher slew rate than the slew rate at which signals are received from the automated testing equipment. In order to do so, the testing interface includes components configured for generating addresses, commands, and test data to be conveyed to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent. The systems are optionally configured to include a test plan memory component configured to store one or more test plans. A test plan may include a sequence of test patterns and/or conditional branches whereby the tests to be performed next are dependent on the results of the preceding tests. The test plan memory is, optionally, be detachable from the test module.
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