Invention Grant
- Patent Title: Shield casing and electronic apparatus
- Patent Title (中): 屏蔽套管和电子设备
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Application No.: US12360750Application Date: 2009-01-27
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Publication No.: US08284569B2Publication Date: 2012-10-09
- Inventor: Masato Yamazaki , Michiaki Hiraoka
- Applicant: Masato Yamazaki , Michiaki Hiraoka
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP2008-018148 20080129
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
A shield casing, which is configured to surround an electronic component mounted on a circuit board, includes a frame body including an engagement recess and a lid body including a hook unit configured to engage with the engagement recess. The lid body is fitted to the frame body to cover the frame body. The hook unit is elastically deformable in a second direction that is opposite to a first direction in which the lid body is fitted to the frame body as the lid body is fitted to the frame body, and then snaps into mating engagement in the engagement recess.
Public/Granted literature
- US20090190321A1 Shield Casing and Electronic Apparatus Public/Granted day:2009-07-30
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