Invention Grant
- Patent Title: Electrical connector assembly with low profile
- Patent Title (中): 电连接器组件具有低外形
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Application No.: US12632847Application Date: 2009-12-08
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Publication No.: US08259462B2Publication Date: 2012-09-04
- Inventor: Shuo-Hsiu Hsu , Nan-Hung Lin
- Applicant: Shuo-Hsiu Hsu , Nan-Hung Lin
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Main IPC: H05K7/02
- IPC: H05K7/02

Abstract:
An electrical connector assembly (100) includes an insulative housing (2), a micro chip (1) arranged on the insulative housing, a PCB (3) located below the insulative housing, a number of contacts (5) received in the insulative housing and a locking element (4) interconnecting the insulative housing onto the PCB. The contacts extend beyond an upper surface of the insulative housing and solder with the micro chip. The contacts extend below a lower surface of the insulative housing and contact with the PCB.
Public/Granted literature
- US20100144166A1 ELECTRICAL CONNECTOR ASSEMBLY WITH LOW PROFILE Public/Granted day:2010-06-10
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