Invention Grant
- Patent Title: Metal injection molded heat dissipation device
- Patent Title (中): 金属注塑散热装置
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Application No.: US12323318Application Date: 2008-11-25
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Publication No.: US08259451B2Publication Date: 2012-09-04
- Inventor: Gavin D. Stanley , Michael T. Crocker
- Applicant: Gavin D. Stanley , Michael T. Crocker
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34
Abstract:
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein tile base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.
Public/Granted literature
- US20100127388A1 METAL INJECTION MOLDED HEAT DISSIPATION DEVICE Public/Granted day:2010-05-27
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