Invention Grant
- Patent Title: Extracting and installing structure for electrical device
- Patent Title (中): 电气设备的提取和安装结构
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Application No.: US12555147Application Date: 2009-09-08
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Publication No.: US08259441B2Publication Date: 2012-09-04
- Inventor: Hsien-Cheng Chuang
- Applicant: Hsien-Cheng Chuang
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW98124194A 20090717
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00

Abstract:
An extracting and installing structure for electrical device is disclosed, which comprises: a base for receiving an electrical device; a first chute; a linkage rod, configured with a first protrusion and capable of sliding inside the first chute in a first direction; and a rotatable tenon, configured with a second chute and an interlocking end as the second chute is provided for the first protrusion of the linkage rod to inset therein and the interlocking end is fitted inside an interlocking element of the base; wherein, when the linkage rod is driven to rotate the rotatable tenon, the rotatable tenon is going to force the electrical device to move in a second direction perpendicular to the first direction.
Public/Granted literature
- US20110013352A1 EXTRACTING AND INSTALLING STRUCTURE FOR ELECTRICAL DEVICE Public/Granted day:2011-01-20
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