Invention Grant
- Patent Title: Foldable polymer-based coil structure and method for fabricating the same
- Patent Title (中): 可折叠聚合物基线圈结构及其制造方法
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Application No.: US12106296Application Date: 2008-04-19
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Publication No.: US08258909B2Publication Date: 2012-09-04
- Inventor: Wen Li , Damien C Rodger , Yu-Chong Tai
- Applicant: Wen Li , Damien C Rodger , Yu-Chong Tai
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Bingham McCutchen LLP
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28

Abstract:
A foldable polymer-based coil structure and a method for fabricating the same are disclosed. The coil structure has metal wirings and interconnections between the wirings. The wirings and connections are embedded by a polymer. The coil structure is foldable in two or more layers. In the folded condition, coils of one layer overlap the coils of another layer. A stackable structure and jigs for aligning the foldable and stackable structures are also disclosed.
Public/Granted literature
- US20080262611A1 FOLDABLE POLYMER-BASED COIL STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-10-23
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