Invention Grant
- Patent Title: High-speed bandpass serial data link
- Patent Title (中): 高速带通串行数据链路
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Application No.: US12388752Application Date: 2009-02-19
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Publication No.: US08258892B2Publication Date: 2012-09-04
- Inventor: Ramesh Abhari , Asanee Suntives , Gordon W. Roberts , Nathan Smith
- Applicant: Ramesh Abhari , Asanee Suntives , Gordon W. Roberts , Nathan Smith
- Applicant Address: unknown Montreal, Quebec
- Assignee: The Royal Institution for the Advancement of Learning/McGill University
- Current Assignee: The Royal Institution for the Advancement of Learning/McGill University
- Current Assignee Address: unknown Montreal, Quebec
- Agency: Freedman & Associates
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H01P3/08

Abstract:
The present invention relates to a method and system for high-speed bandpass serial data communication. A driver receives at least one data signal and generates a bandpass data signal for transmission through a bandpass waveguide interconnect. The bandpass data signal is launched into the bandpass waveguide interconnect using a first adaptor and extracted therefrom after transmission using a second adaptor. A receiver connected to the second adaptor recovers the at least one data signal from the extracted bandpass data signal. A dispersion compensation circuit receives one of the at least one data signal and the bandpass data signal and information indicative of a phase response of the bandpass waveguide interconnect and dispersion compensates the one of the at least one data signal and the bandpass data signal by compensating the phase response of the bandpass waveguide interconnect.
Public/Granted literature
- US20090220240A1 HIGH-SPEED BANDPASS SERIAL DATA LINK Public/Granted day:2009-09-03
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