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US08258682B2 High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods 有权
用于固态发光装置的高导热性包装和相关组装方法

  • Patent Title: High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods
  • Patent Title (中): 用于固态发光装置的高导热性包装和相关组装方法
  • Application No.: US11673951
    Application Date: 2007-02-12
  • Publication No.: US08258682B2
    Publication Date: 2012-09-04
  • Inventor: Russell George Villard
  • Applicant: Russell George Villard
  • Applicant Address: US NC Durham
  • Assignee: Cree, Inc.
  • Current Assignee: Cree, Inc.
  • Current Assignee Address: US NC Durham
  • Agency: Myers Bigel Sibley & Sajovec
  • Main IPC: H01J7/24
  • IPC: H01J7/24
High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods
Abstract:
One or more solid state light emitting elements are mounted on a hardcoat anodized aluminum substrate. One or more bars also may be provided that slidably contact an edge of the hardcoat anodized aluminum substrate. The substrate and the bar(s) may be mounted in a housing with the bars mounted in apertures in the housing wall. Related assembling methods for solid state light emitting apparatus also are disclosed.
Abstract(Chinese):

一个或多个固态发光元件安装在硬涂阳极氧化铝基板上。 还可以提供一个或多个棒，其可滑动地接触硬质阳极氧化铝基底的边缘。 衬底和杆可以安装在壳体中，杆安装在壳体壁中的孔中。 还公开了固态发光装置的相关组装方法。

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