Invention Grant
- Patent Title: Offset gate semiconductor device
- Patent Title (中): 偏移门半导体器件
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Application No.: US12846457Application Date: 2010-07-29
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Publication No.: US08258584B2Publication Date: 2012-09-04
- Inventor: Chun-Hung Chen , Lee-Wee Teo , Ming Zhu , Bao-Ru Young , Harry Hak-Lay Chuang
- Applicant: Chun-Hung Chen , Lee-Wee Teo , Ming Zhu , Bao-Ru Young , Harry Hak-Lay Chuang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing, Inc.
- Current Assignee: Taiwan Semiconductor Manufacturing, Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94

Abstract:
An offset gate semiconductor device includes a substrate and an isolation feature formed in the substrate. An active region is formed in the substrate substantially adjacent to the isolation feature. An interface layer is formed on the substrate over the isolation feature and the active region. A polysilicon layer is formed on the interface layer over the isolation feature and the active region. A trench being formed in the polysilicon layer over the isolation feature. The trench extending to the interface layer. A fill layer is formed to line the trench and a metal gate formed in the trench.
Public/Granted literature
- US20120025309A1 OFFSET GATE SEMICONDUCTOR DEVICE Public/Granted day:2012-02-02
Information query
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