Invention Grant
- Patent Title: Wiring board and method of preventing high voltage damage
- Patent Title (中): 接线板及防止高压损坏的方法
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Application No.: US12238729Application Date: 2008-09-26
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Publication No.: US08258407B2Publication Date: 2012-09-04
- Inventor: Koji Kishimoto
- Applicant: Koji Kishimoto
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco
- Priority: JP2007-258920 20071002
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/16 ; H05K1/14 ; H05K7/00

Abstract:
A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern (3) including mounting pads (8, 10), on which an electronic device (5) is mounted, a second wiring pattern (21) having lower impedance than the first wiring pattern (3), ICT wirings (13, 15) extending from the mounting pads (8, 10) of the first wiring pattern (3), and ICT pads (17, 19) formed at distal ends of the ICT wirings (13, 15). The ICT wirings (13, 15) extend towards the second wiring pattern (21) so that the ICT pads (13, 15) are in the vicinity of the second wiring pattern (21), and discharge gaps (G) are formed between the ICT pads (13, 15) and the second wiring pattern (21).
Public/Granted literature
- US20090084587A1 WIRING BOARD AND METHOD OF PREVENTING HIGH VOLTAGE DAMAGE Public/Granted day:2009-04-02
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