Invention Grant
US08238113B2 Electronic module with vertical connector between conductor patterns
有权
导体图案之间具有垂直连接器的电子模块
- Patent Title: Electronic module with vertical connector between conductor patterns
- Patent Title (中): 导体图案之间具有垂直连接器的电子模块
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Application No.: US12842052Application Date: 2010-07-23
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Publication No.: US08238113B2Publication Date: 2012-08-07
- Inventor: Antti Iihola , Petteri Palm
- Applicant: Antti Iihola , Petteri Palm
- Applicant Address: FI Espoo
- Assignee: Imbera Electronics Oy
- Current Assignee: Imbera Electronics Oy
- Current Assignee Address: FI Espoo
- Agency: Seppo Laine Oy
- Agent Joshua P. Wert
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K7/00
Abstract:
The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.
Public/Granted literature
- US20120020044A1 ELECTRONIC MODULE WITH VERTICAL CONNECTOR BETWEEN CONDUCTOR PATTERNS Public/Granted day:2012-01-26
Information query
