Invention Grant
- Patent Title: Heat sink and electronic device using the same
- Patent Title (中): 散热器和电子设备使用相同
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Application No.: US12849936Application Date: 2010-08-04
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Publication No.: US08238105B2Publication Date: 2012-08-07
- Inventor: Zhi-Bin Guan , Yao-Ting Chang , Zeu-Chia Tan
- Applicant: Zhi-Bin Guan , Yao-Ting Chang , Zeu-Chia Tan
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99119865A 20100618
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis.
Public/Granted literature
- US20110310567A1 HEAT SINK AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2011-12-22
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