Invention Grant
- Patent Title: Image sensor and method for manufacturing the same
- Patent Title (中): 图像传感器及其制造方法
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Application No.: US12509548Application Date: 2009-07-27
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Publication No.: US08237833B2Publication Date: 2012-08-07
- Inventor: Gun Hyuk Lim
- Applicant: Gun Hyuk Lim
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2008-0074138 20080729
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H01L21/00 ; H01L31/062

Abstract:
Provided are an image sensor and a method for manufacturing the same. The image sensor comprises: a readout circuitry, an interconnection, a contact plug, and an image sensing device. The readout circuitry is formed in a first substrate. The interconnection is electrically connected to the readout circuitry over the first substrate. The contact plug is formed over the interconnection, and includes an insulating layer at regions in an upper side thereof. The image sensing device is formed over the contact plug.
Public/Granted literature
- US20100026864A1 IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-02-04
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