Invention Grant
- Patent Title: Image sensor with focusing interconnections
- Patent Title (中): 具有聚焦互连的图像传感器
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Application No.: US12130950Application Date: 2008-05-30
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Publication No.: US08237832B2Publication Date: 2012-08-07
- Inventor: Hidetoshi Nozaki
- Applicant: Hidetoshi Nozaki
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L31/0232
- IPC: H01L31/0232

Abstract:
An image sensor includes a photosensitive region formed in a substrate of an integrated circuit. The substrate has a first layer of metal formed over the surface of the substrate so the first layer of metal defines a first aperture that has a first aperture width through with the incident light passes before illuminating the photosensitive region. The first aperture width is equal to or less than the width of the photosensitive region below the first aperture. The substrate also has a second layer of metal formed over the first layer of metal. The second aperture has a second aperture width that is wider than the first aperture width. The first and second apertures focus the incident light onto the photosensitive region.
Public/Granted literature
- US20090295953A1 IMAGE SENSOR WITH FOCUSING INTERCONNECTION Public/Granted day:2009-12-03
Information query
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