Invention Grant
- Patent Title: Moving device and electronic component mounting
- Patent Title (中): 移动设备和电子元件安装
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Application No.: US12447994Application Date: 2007-11-01
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Publication No.: US08237781B2Publication Date: 2012-08-07
- Inventor: Jun Yamauchi , Naoto Kohketsu , Tadashi Endo , Yasuichi Okada
- Applicant: Jun Yamauchi , Naoto Kohketsu , Tadashi Endo , Yasuichi Okada
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-299929 20061106
- International Application: PCT/JP2007/071668 WO 20071101
- International Announcement: WO2008/056721 WO 20080515
- Main IPC: H04N7/18
- IPC: H04N7/18

Abstract:
An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced.
Public/Granted literature
- US20100060724A1 MOVING DEVICE AND ELECTRONIC COMPONENT MOUNTING APPARATUS Public/Granted day:2010-03-11
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