Various embodiments include a thermal protector, including the rear end of a movable plate fixed to one end of a resin base and a pair of terminals for connection with an external circuit fixed to the other end thereof. Fixed contacts are formed on the fixed portions of the terminals, and the movable contact of the movable plate is disposed opposed to the fixed contacts. A bimetal element engaged with the center of the movable plate is set to project upward at normal temperature, thus bringing the movable contact into pressure contact with the fixed contacts with prescribed contact pressure. The bimetal element consists of an inversion area wherein the inversion area has no portion overlapping the conduction path area of load current.