Invention Grant
- Patent Title: Enhanced substrate using metamaterials
- Patent Title (中): 使用超材料增强底物
-
Application No.: US12097128Application Date: 2006-12-15
-
Publication No.: US08237516B2Publication Date: 2012-08-07
- Inventor: Chris Wyland
- Applicant: Chris Wyland
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- International Application: PCT/IB2006/054899 WO 20061215
- International Announcement: WO2007/069224 WO 20070621
- Main IPC: H04B3/54
- IPC: H04B3/54 ; H01P1/203

Abstract:
In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate (10) is configured as a meta-material. The meta-material provides noise protection for a signal line (15) having a pre-determined length disposed on the meta-material. The substrate comprises a dielectric material (2, 4, 6) having a topside surface and an underside surface. A conductive material (30) is arranged into pre-determined shapes (35) having a collective length. Dielectric material envelops the conductive material and the conductive material is disposed at a first predetermined distance (55) from the topside surface and at a second predetermined distance from the underside surface. The collective length of the conductive material (30) is comparable to the pre-determined length of the signal line (15).
Public/Granted literature
- US20080266028A1 Enhanced Substrate Using Metamaterials Public/Granted day:2008-10-30
Information query