Invention Grant
US08237290B2 Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads
有权
组件和多芯片模块，包括具有中心定位的引线键合焊盘的堆叠半导体晶片
- Patent Title: Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads
- Patent Title (中): 组件和多芯片模块，包括具有中心定位的引线键合焊盘的堆叠半导体晶片
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Application No.: US12354059Application Date: 2009-01-15
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Publication No.: US08237290B2Publication Date: 2012-08-07
- Inventor: Eric Tan Swee Seng
- Applicant: Eric Tan Swee Seng
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Priority: SG2004043171 20040729
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
An assembly method that includes providing a first semiconductor device and positioning a second semiconductor device at least partially over the first semiconductor device is disclosed. Spacers space the active surface of the first semiconductor device substantially a predetermined distance apart from the back side of the second semiconductor device. Discrete conductive elements are extended between the active surface of the first semiconductor device and the substrate prior to positioning of the second semiconductor device. Intermediate portions of the discrete conductive elements pass through an aperture formed between the active surface of the first semiconductor device, the back side of the second semiconductor device, and two of the spacers positioned therebetween. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.
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