A system in package device according to an example of the present invention includes a package substrate, an external terminal which is arranged on one face side or the other face side of the package substrate, a first chip which is arranged on the other face side of the package substrate, a second chip which is arranged on the first chip, and bumps which are arranged between the first chip and the second chip. A signal to be input into the external terminal is input into the first chip via the second chip.