Invention Grant
US08237262B2 Method and system for innovative substrate/package design for a high performance integrated circuit chipset
有权
用于高性能集成电路芯片组的创新衬底/封装设计方法和系统
- Patent Title: Method and system for innovative substrate/package design for a high performance integrated circuit chipset
- Patent Title (中): 用于高性能集成电路芯片组的创新衬底/封装设计方法和系统
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Application No.: US12963465Application Date: 2010-12-08
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Publication No.: US08237262B2Publication Date: 2012-08-07
- Inventor: Edmund Law
- Applicant: Edmund Law
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L23/043
- IPC: H01L23/043
Abstract:
Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC power and a grounding function on a metal 2 substrate layer and utilizing all of a metal 3 substrate layer for the grounding function. Portions of the metal 2 layer and a metal 4 layer are utilized for the IC power, wherein all of the IC power is centralized underneath the die.
Public/Granted literature
Information query
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