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Invention Grant
US08237257B2 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same 有权
衬底结构，其内嵌有模具，并且在两个侧表面上具有双层叠层及其方法

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
Abstract:
The present invention discloses a structure of device package comprising a first substrate with a die metal pad, a first wiring circuit on top surface of said first substrate and a second wiring circuit on bottom surface of said first substrate. A die is disposed on the die metal pad. A second substrate has a die opening window for receiving the die, a third wiring circuit on top surface of the second substrate and a fourth wiring circuit on bottom surface of the second substrate. An adhesive material is filled into the gap between back side of the die and top surface of the first substrate and between the side wall of the die and the side wall of the die receiving through hole and the bottom side of the second substrate.
Abstract(Chinese):

本发明公开了一种器件封装的结构，该器件封装包括具有管芯金属焊盘的第一衬底，在所述第一衬底的顶表面上的第一布线电路和在所述第一衬底的底表面上的第二布线电路。 模具设置在金属模具上。 第二基板具有用于接收管芯的开口窗口，在第二基板的顶表面上的第三布线电路和在第二基板的底表面上的第四布线电路。 将粘合剂材料填充到模具的背面和第一基板的顶表面之间以及模具的侧壁和模具的侧壁之间的间隙中，模具的通孔和第二基板的底侧。

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