Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12877882Application Date: 2010-09-08
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Publication No.: US08237219B2Publication Date: 2012-08-07
- Inventor: Akihiro Usujima , Shigeo Satoh
- Applicant: Akihiro Usujima , Shigeo Satoh
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2009-208306 20090909
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L21/336

Abstract:
A semiconductor device includes a first transistor including a first source/drain region and a first sidewall spacer, and a second transistor including a second source/drain region and a second sidewall spacer, the first sidewall spacer has a first width and the second sidewall spacer has a second width wider than the first width, and the first source/drain region has a first area and the second source/drain region has a second area larger than the first area.
Public/Granted literature
- US20110057253A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2011-03-10
Information query
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