Invention Grant
US08237195B2 Power MOSFET having a strained channel in a semiconductor heterostructure on metal substrate
有权
功率MOSFET在金属衬底上的半导体异质结构中具有应变通道
- Patent Title: Power MOSFET having a strained channel in a semiconductor heterostructure on metal substrate
- Patent Title (中): 功率MOSFET在金属衬底上的半导体异质结构中具有应变通道
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Application No.: US12248874Application Date: 2008-10-09
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Publication No.: US08237195B2Publication Date: 2012-08-07
- Inventor: Tat Ngai , Qi Wang , Joelle Sharp
- Applicant: Tat Ngai , Qi Wang , Joelle Sharp
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Kilpatrick Townsend & Stockton, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A field effect transistor device having a strained semiconductor channel region overlying a heterostructure-semiconductor on a metal substrate includes a first semiconductor layer overlying a first metal layer. The first semiconductor layer has a first semiconductor material and a second semiconductor material in a relaxed heterostructure and is heavily doped. A second semiconductor layer overlies the first semiconductor layer and has a first semiconductor material and a second semiconductor material in a relaxed heterostructure. The second semiconductor layer is more lightly doped than the first semiconductor layer. A trench extends into the second semiconductor layer and a channel region has a strained layer of the first semiconductor material adjacent a trench sidewall. The strained channel region provides enhanced carrier mobility and improves performance of the field effect transistor.
Public/Granted literature
- US20100078682A1 POWER MOSFET HAVING A STRAINED CHANNEL IN A SEMICONDUCTOR HETEROSTRUCTURE ON METAL SUBSTRATE Public/Granted day:2010-04-01
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