Invention Grant
- Patent Title: Image sensor package and image sensing module using same
- Patent Title (中): 图像传感器封装和图像传感模块使用相同
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Application No.: US12633888Application Date: 2009-12-09
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Publication No.: US08237190B2Publication Date: 2012-08-07
- Inventor: Ga-Lane Chen
- Applicant: Ga-Lane Chen
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910303259 20090615
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An exemplary image sensor package includes a base substrate, an image sensor, and a number of wires. The base substrate contains carbon nanotubes and alumina, and includes a number of base pads. The image sensor is mounted on the base substrate, and includes a sensing portion and a number of contacts. The wires electrically connect the base pads to the respective contacts.
Public/Granted literature
- US20100314703A1 IMAGE SENSOR PACKAGE AND IMAGE SENSING MODULE USING SAME Public/Granted day:2010-12-16
Information query
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