Invention Grant
- Patent Title: Organic adhesive light-emitting device with ohmic metal bulge
- Patent Title (中): 有机粘合剂发光装置,欧姆金属凸起
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Application No.: US10905697Application Date: 2005-01-18
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Publication No.: US08237182B2Publication Date: 2012-08-07
- Inventor: Min-Hsun Hsieh , Wen-Huang Liu , Tzu-Feng Tseng , Ya-Lan Yang
- Applicant: Min-Hsun Hsieh , Wen-Huang Liu , Tzu-Feng Tseng , Ya-Lan Yang
- Applicant Address: TW Science-based Industrial Park, Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Science-based Industrial Park, Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW93104393A 20040220
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Organic adhesive light-emitting device with ohmic metal bulge. The organic adhesive light-emitting device includes a conductive substrate, a light-emitting stack layer, a metal layer formed over the conductive substrate, a reflective layer formed over the light-emitting stack layer, and an organic adhesive layer having an ohmic metal bulge and an adhesive material around the ohmic metal bulge. The adhesive material bonds the metal layer and the reflective layer together, while the ohmic metal bulge forms ohmic contacts with the metal layer and the reflective layer. The configuration can simplify a light-emitting diode.
Public/Granted literature
- US20050194587A1 ORGANIC ADHESIVE LIGHT-EMITTING DEVICE WITH OHMIC METAL BULGE Public/Granted day:2005-09-08
Information query
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