Invention Grant
- Patent Title: Adhesive compositions
- Patent Title (中): 粘合剂组合物
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Application No.: US12462163Application Date: 2009-07-30
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Publication No.: US08236886B2Publication Date: 2012-08-07
- Inventor: Chun D. Lee , Charles S. Holland
- Applicant: Chun D. Lee , Charles S. Holland
- Applicant Address: US TX Houston
- Assignee: Equistar Chemicals, LP
- Current Assignee: Equistar Chemicals, LP
- Current Assignee Address: US TX Houston
- Main IPC: C09B67/00
- IPC: C09B67/00 ; C08L51/00
Abstract:
Adhesive compositions suitable for use as tie-layer adhesives in multi-layer films and sheets are provided. The adhesive compositions contain an olefin polymer base resin, a modified polyolefin and a paraffinic liquid hydrocarbon.
Public/Granted literature
- US20110027583A1 Adhesive compositions Public/Granted day:2011-02-03
Information query
