Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
- Patent Title (中): 半导体装置及半导体装置的制造方法
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Application No.: US12636961Application Date: 2009-12-14
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Publication No.: US08236672B2Publication Date: 2012-08-07
- Inventor: Takako Chinone , Ji-Hao Liang , Yasuyuki Shibata , Jiro Higashino
- Applicant: Takako Chinone , Ji-Hao Liang , Yasuyuki Shibata , Jiro Higashino
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2008-327478 20081224
- Main IPC: H01L21/36
- IPC: H01L21/36 ; H01L21/20 ; H01L21/00 ; H01L29/24 ; H01L21/18 ; H01L27/108

Abstract:
A cavity-containing layer having a plurality of cavities is formed on a growth substrate by carrying out in alternating fashion a plurality of cycles of a first and second growth steps of growing a group III nitride at growth rates different from each other. The semiconductor epitaxial layer is subsequently formed on the cavity-containing layer, after which a support substrate is bonded to the semiconductor epitaxial layer. The growth substrate is separated from the cavity-containing layer.
Public/Granted literature
- US20100155740A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2010-06-24
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