Invention Grant
US08236655B2 Fuse link structures using film stress for programming and methods of manufacture
有权
使用膜应力的熔断器连接结构进行编程和制造方法
- Patent Title: Fuse link structures using film stress for programming and methods of manufacture
- Patent Title (中): 使用膜应力的熔断器连接结构进行编程和制造方法
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Application No.: US12939538Application Date: 2010-11-04
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Publication No.: US08236655B2Publication Date: 2012-08-07
- Inventor: Karl W. Barth , Jeffrey P. Gambino , Tom C. Lee , Kevin S. Petrarca
- Applicant: Karl W. Barth , Jeffrey P. Gambino , Tom C. Lee , Kevin S. Petrarca
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L21/336
- IPC: H01L21/336
Abstract:
A method of forming a programmable fuse structure includes forming at least one shallow trench isolation (STI) in a substrate, forming an e-fuse over the at least one STI and depositing an interlevel dielectric (ILD) layer over the e-fuse. Additionally, the method includes removing at least a portion of the at least one STI under the e-fuse to provide an air gap below a portion of the e-fuse and removing at least a portion of the ILD layer over the e-fuse to provide the air gap above the portion of the e-fuse.
Public/Granted literature
- US20110045644A1 FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS OF MANUFACTURE Public/Granted day:2011-02-24
Information query
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