Invention Grant
- Patent Title: Semiconductor device manufacturing method
- Patent Title (中): 半导体器件制造方法
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Application No.: US13071083Application Date: 2011-03-24
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Publication No.: US08236639B2Publication Date: 2012-08-07
- Inventor: Hiroaki Kikuchi , Katsunori Kondo , Shigeru Shinohara , Osamu Takahashi , Tomoaki Yamabayashi
- Applicant: Hiroaki Kikuchi , Katsunori Kondo , Shigeru Shinohara , Osamu Takahashi , Tomoaki Yamabayashi
- Applicant Address: JP Tokyo
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2010-076646 20100330
- Main IPC: H01L21/765
- IPC: H01L21/765 ; H01L21/8239

Abstract:
A semiconductor device manufacturing method is a method of forming a semiconductor device that includes a cell part that includes plural transistor cells in each of which a gate of a trench type is formed in a semiconductor layer, and diffused layers are formed on both sides of the gate, and a guard ring part that surrounds the cell part. The semiconductor device manufacturing method includes forming an interlayer dielectric film on a surface of the semiconductor layer in which the gate and the diffused layers are formed; reducing a thickness of the interlayer dielectric film formed in the cell part through etch back; forming a contact part having a shape of a hole or a groove in the interlayer dielectric film at a position above the diffused layer; and forming a metal film on the interlayer dialectic film.
Public/Granted literature
- US20110244638A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2011-10-06
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