Planar silicide semiconductor structure

Invention Grant

US08236637B2 Planar silicide semiconductor structure 失效

Title translation: 平面硅化物半导体结构

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Patent Title: Planar silicide semiconductor structure
Patent Title (中): 平面硅化物半导体结构
Application No.: US12893245

Application Date: 2010-09-29
Publication No.: US08236637B2

Publication Date: 2012-08-07
Inventor: Henry K. Utomo , Sameer Hemchand Jain , Ravikumar Ramachandran , Cung D. Tran
Applicant: Henry K. Utomo , Sameer Hemchand Jain , Ravikumar Ramachandran , Cung D. Tran
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agent Howard M. Cohn; H. Daniel Schnurmann
Main IPC: H01L21/8238
IPC: H01L21/8238

Abstract:

A planar silicide structure and method of fabrication is disclosed. A FET having a silicided raised source-drain structure is formed where the height of the source-drain structures are the same as the height of the gates, simplifying the process of forming contacts on the FET. One embodiment utilizes a replacement metal gate FET and another embodiment utilizes a gate-first FET.

Abstract(Chinese):

公开了一种平面硅化物结构及其制造方法。形成具有硅化凸起源极 - 漏极结构的FET，其中源极 - 漏极结构的高度与栅极的高度相同，从而简化了在FET上形成接触的过程。一个实施例使用替换金属栅极FET，另一个实施例利用栅极 - 第一FET。

Public/Granted literature

US20120074503A1 Planar Silicide Semiconductor Structure Public/Granted day:2012-03-29

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS