Invention Grant
- Patent Title: Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
- Patent Title (中): 具有堆叠集成电路的集成电路封装系统及其制造方法
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Application No.: US12488383Application Date: 2009-06-19
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Publication No.: US08236607B2Publication Date: 2012-08-07
- Inventor: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- Applicant: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/52 ; H01L23/498 ; H01L23/538
Abstract:
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a base component to the substrate by a first interconnect; attaching a stack component connected by a second interconnect to the substrate and partially over the base component, the second interconnect different from the first interconnect; molding an encapsulation over the base component, the first interconnect, the stack component, and the second interconnect; and removing the substrate to partially expose the first interconnect and the second interconnect from the encapsulation.
Public/Granted literature
- US20100320586A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-12-23
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