Invention Grant
- Patent Title: Method for printing a pattern on a substrate
- Patent Title (中): 在基板上印刷图案的方法
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Application No.: US12349608Application Date: 2009-01-07
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Publication No.: US08236479B2Publication Date: 2012-08-07
- Inventor: Michael Lee Rudolph
- Applicant: Michael Lee Rudolph
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/26 ; G03C1/00

Abstract:
A pattern of ink is printed on a substrate, such as corrugated paperboard with a relief printing form made from a photosensitive element. An in-situ mask is formed for the photosensitive element, the element is exposed to actinic radiation through the in-situ mask in an environment having an inert gas and a concentration of oxygen between 190,000 and 100 ppm, and the exposed element is treated to form the relief printing form having a pattern of printing areas. Printing is accomplished by securing the relief printing form to a print press, applying the ink to the printing areas on the printing form, and contacting the ink from the printing areas to the substrate to transfer the pattern of ink onto the substrate.
Public/Granted literature
- US20090186308A1 METHOD FOR PRINTING A PATTERN ON A SUBSTRATE Public/Granted day:2009-07-23
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