Invention Grant
- Patent Title: Resin infusion potting
- Patent Title (中): 树脂灌注灌封
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Application No.: US12658925Application Date: 2010-02-17
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Publication No.: US08236219B2Publication Date: 2012-08-07
- Inventor: Richard V. Campbell , Kevin J. Barefield
- Applicant: Richard V. Campbell , Kevin J. Barefield
- Applicant Address: US FL Havana
- Assignee: Bright Technologies, Inc.
- Current Assignee: Bright Technologies, Inc.
- Current Assignee Address: US FL Havana
- Agent J. Wiley Horton
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
A process for forcibly infusing liquid potting compound into the strands of a cable in order to attach an anchor to the cable. The process uses a strand cavity within an anchor that encloses the exposed strands. The strand cavity is sealed. Liquid potting compound is then forced into the strand cavity, where it runs around and through the exposed strands. A second venting passage is preferably employed, so that the liquid potting compound flows through the mold without trapping any substantial air pockets.
Public/Granted literature
- US20100187721A1 Resin infusion potting Public/Granted day:2010-07-29
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