A method for manufacturing a thin film multilayer device includes bonding a plastic substrate to a support substrate using an adhesive so that an upper film and a lower film constituting a weak adhesive inorganic film are sandwiched between the plastic substrate and the support substrate, and the plastic substrate is supported by the support substrate with an adhesive force stronger than an adhesive force between the upper and lower films, stacking a plurality of thin films on the plastic substrate supported by the support substrate, and separating the upper film from the lower film to separate the plastic substrate on which the plurality of thin films are stacked, from the support substrate.