Invention Grant
- Patent Title: Shower head and substrate processing apparatus
- Patent Title (中): 淋浴头和基材加工设备
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Application No.: US12403722Application Date: 2009-03-13
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Publication No.: US08236106B2Publication Date: 2012-08-07
- Inventor: Hachishiro Iizuka , Fumiko Kiriishi , Tsuyoshi Komiyama
- Applicant: Hachishiro Iizuka , Fumiko Kiriishi , Tsuyoshi Komiyama
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-065352 20080314
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23F1/00 ; H01L21/306 ; C23C16/06 ; C23C16/22

Abstract:
A shower head is provided in a processing chamber for processing a substrate therein. Further, the shower head has a facing surface facing a mounting table for mounting thereon the substrate and serves to supply one or more gases through the facing surface toward the substrate. The shower head includes a central gas supply unit for supplying a first gas through a central portion of the facing surface toward the substrate, a peripheral gas supply unit for supplying a second gas through a peripheral portion of the facing surface toward the substrate and a gas exhaust unit, provided with a plurality of gas exhaust holes formed between the central gas supply unit and the peripheral gas supply unit, for exhausting the first and the second gas from the facing surface.
Public/Granted literature
- US20090229754A1 SHOWER HEAD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2009-09-17
Information query
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