Invention Grant
- Patent Title: Preparation method of copper particle composition
- Patent Title (中): 铜粒子组成的制备方法
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Application No.: US12452751Application Date: 2008-07-24
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Publication No.: US08236089B2Publication Date: 2012-08-07
- Inventor: Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
- Applicant: Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2007-0075341 20070726; KR10-2008-0022121 20080310
- International Application: PCT/KR2008/004342 WO 20080724
- International Announcement: WO2009/014392 WO 20090129
- Main IPC: B22F9/24
- IPC: B22F9/24

Abstract:
A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of −0.2 to −0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10%, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40%; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.
Public/Granted literature
- US20100116089A1 PREPARATION METHOD OF COPPER PARTICLE COMPOSITION Public/Granted day:2010-05-13
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