Invention Grant
- Patent Title: Connector module and patch panel
- Patent Title (中): 连接器模块和接线板
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Application No.: US13051908Application Date: 2011-03-18
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Publication No.: US08235731B1Publication Date: 2012-08-07
- Inventor: Jeffrey Alan Poulsen , Bryan L. Sparrowhawk , Jason Erickson , Bret Taylor , Adam Bily
- Applicant: Jeffrey Alan Poulsen , Bryan L. Sparrowhawk , Jason Erickson , Bret Taylor , Adam Bily
- Applicant Address: US NY Melville
- Assignee: Leviton Manufacturing Co., Ltd.
- Current Assignee: Leviton Manufacturing Co., Ltd.
- Current Assignee Address: US NY Melville
- Agency: Davis Wright Tremaine LLP
- Agent George C. Rondeau, Jr.; Heather M. Colburn
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A substrate operable to construct a male-type connector, a female-type connector, and/or a multi-outlet module. The substrate has a plurality of circuits and an edge card male connector including contacts for each circuit. For each circuit, the substrate has a ground plane connected to one or more of the contacts for the circuit. The ground planes may be implemented as localized, electrically floating, isolated ground planes. The substrate may include multiple layers upon which portions of the circuits and ground planes may be disposed. The ground plane corresponding to each of the plurality of circuits may be located in close proximity to conductive elements of the circuit so as to provide a localized common ground to which energy can be conveyed from the conductive elements to thereby limit an amount of energy radiated outwardly from the conductive elements to surrounding conductors.
Information query