Invention Grant
US08235605B2 Self-standing parallel plate beam splitter, method for manufacturing the same, and laser diode package structure using the same 有权
自平行平板光束分离器,其制造方法和使用其的激光二极管封装结构

  • Patent Title: Self-standing parallel plate beam splitter, method for manufacturing the same, and laser diode package structure using the same
  • Patent Title (中): 自平行平板光束分离器,其制造方法和使用其的激光二极管封装结构
  • Application No.: US12531950
    Application Date: 2008-03-18
  • Publication No.: US08235605B2
    Publication Date: 2012-08-07
  • Inventor: Jeong Soo Kim
  • Applicant: Jeong Soo Kim
  • Agency: Drinker Biddle & Reath LLP
  • Priority: KR10-2007-0026558 20070319; KR10-2007-0060267 20070620; KR10-2007-0108008 20071025; KR10-2007-0120602 20071126; KR10-2008-0001466 20080104; KR10-2008-0002613 20080109; KR10-2008-0007104 20080123; KR10-2008-0020534 20080305
  • International Application: PCT/KR2008/001520 WO 20080318
  • International Announcement: WO2008/114991 WO 20080925
  • Main IPC: G02B6/36
  • IPC: G02B6/36 G02B27/14 H04B10/12 B05D5/06 G03F7/20
Self-standing parallel plate beam splitter, method for manufacturing the same, and laser diode package structure using the same
Abstract:
Disclosed herein are a self-standing parallel plate beam splitter, a method for manufacturing the same, and a laser diode package structure using the same. The self-standing parallel plate beam splitter according to the present invention is easy to manufacture and is applicable to various laser diode packages, thereby enabling easy implementation of a laser diode package that is capable of performing bidirectional communication, a laser diode package having a triplexer function, a laser diode package having a wavelength locking function, and a laser diode package having a front side monitoring function to monitor the operation state of a laser diode chip using some of laser light emitted from the front side of the laser diode chip.
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