Invention Grant
US08235593B2 Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit
有权
用于实时估计和预测微处理器单元的热状态的方法和系统
- Patent Title: Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit
- Patent Title (中): 用于实时估计和预测微处理器单元的热状态的方法和系统
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Application No.: US12756781Application Date: 2010-04-08
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Publication No.: US08235593B2Publication Date: 2012-08-07
- Inventor: Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
- Applicant: Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Main IPC: G01K3/00
- IPC: G01K3/00 ; G01K7/00
Abstract:
A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip.
Public/Granted literature
- US20100274522A1 Method and System for Real-Time Estimation and Prediction of the Thermal State of a Microprocessor Unit Public/Granted day:2010-10-28
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