Invention Grant
US08235503B2 Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip
有权
半导体元件芯片，采用半导体元件芯片的喷墨头，以及半导体元件芯片的电极接合方法
- Patent Title: Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip
- Patent Title (中): 半导体元件芯片，采用半导体元件芯片的喷墨头，以及半导体元件芯片的电极接合方法
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Application No.: US12326381Application Date: 2008-12-02
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Publication No.: US08235503B2Publication Date: 2012-08-07
- Inventor: Naruyuki Nojo
- Applicant: Naruyuki Nojo
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2007-328707 20071220
- Main IPC: B41J2/01
- IPC: B41J2/01
Abstract:
A semiconductor element substrate includes an electrode pad; a semiconductor element; and a connection heater for heating the electrode pad, wherein the connection heater is disposed in a range capable of heating the electrode pad up to a level capable of electrical connection.
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