Invention Grant
- Patent Title: Ultrasonic bonding method of electric wire
- Patent Title (中): 电线超声波焊接方法
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Application No.: US12879341Application Date: 2010-09-10
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Publication No.: US08235276B2Publication Date: 2012-08-07
- Inventor: Kentaro Ohnuma
- Applicant: Kentaro Ohnuma
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-212292 20090914
- Main IPC: B23K31/02
- IPC: B23K31/02

Abstract:
In an ultrasonic bonding method of an electric wire in which the electric wire 1 in which a conductor end 7 made of plural core wires is exposed and a metallic connection terminal 19 formed by erecting two side walls 27 from a bottom surface are prepared and the conductor end is bonded to the connection terminal by applying ultrasonic vibration while the conductor end of the electric wire is positioned in the bottom surface between the two side walls of the connection terminal and is pushed, a cross section of the conductor end of the electric wire is made by being molded by press so that a thickness of a width direction between the side walls becomes thin toward at least one of the side positioned in the bottom surface of the connection terminal and the side to which the ultrasonic vibration is applied.
Public/Granted literature
- US20110062218A1 ULTRASONIC BONDING METHOD OF ELECTRIC WIRE Public/Granted day:2011-03-17
Information query
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